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Thermal Fatigue Resistant SMT Machine Parts / Tin Lead Free Solder Bar

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Shenzhen Ruidian Electric Co. , Ltd

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Thermal Fatigue Resistant SMT Machine Parts / Tin Lead Free Solder Bar

Model Number : SMT spare parts Tin Lead Free Solder Welding Dim Bar

Place of Origin : shenzhen

MOQ : 1

Price : negotiation

Payment Terms : T/T

Supply Ability : 1000pcs/days

Delivery Time : 8days

Packaging Details : carton

part no : Bar Sn/AG/Cu Sn/Cu Sn/AG

brand : china

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SMT spare parts Tin Lead Free Solder Welding Dim Bar Sn/AG/Cu Sn/Cu Sn/AG

Our company provides Tin Lead Free Solder Bar with a variety of alloy composition , content and size of the diameter of pharmaceutical different specifications tin for customer choice:

Alloy composition (wt.%)				Diameter	Flux Content	Weight / Roll	Melting pointºC	Working point	Usage & Application
Type	Tin-Sn	Silver-Ag	Copper-Cu	Diameter	Flux Content	Weight / Roll	Melting pointºC	Working point	Usage & Application
SAC305	96.50%	3.00%	0.50%	0.8-3.0mm	1.8-2.4%	750-1000g	217-219	280-320	LED, IT, PCB, High-class electronics, Lighting industry, Radiators, Household appliance and Precise Instruments, Audio and Sound System and other soldering
SAC300	97.00%	3.00%	0%				217-220	280-320
SAC0307	99.00%	0.30%	0.70%				217-225	260-320
SAC07	99.30%	0.00%	0.70%				227	260-280

Anti-oxidation tin lead free bar
High temperature tin lead free bar
Low temperature tin lead free bar
Dim tin lead free bar
Silver tin lead free bar
Tin lead free solder bar for other particular applications
3.15cm * 1.5cm * 1.0cm

500g/PC
- Eutectic alloy.
- Bridge-free and icicle-free soldering.
- Smooth, bright, well-formed fillets, free of gross micro-cracks, irrespective of the cooling rate.
- Good through-hole penetration.
- Good topside fillet formation.
- Dross rate equal or lower than tin-lead solder.
- Does not require a nitrogen atmosphere.
- Does not erode copper from holes, pads and tracks.
- Low rate of copper leaching makes it easy to control the copper content of the solder bath.
- Lower aggressiveness to stainless steel and other solder pot materials as compared to tin-silver-copper alloys.
- Thermal fatigue resistance and creep strength better than tin-lead.
- Slow, even growth of the intermetallic layer at the solder/substrate interface.
- Also performs well in selective and dip soldering.

Thermal Fatigue Resistant SMT Machine Parts / Tin Lead Free Solder Bar

Product Tags:

surface mount components

smt spare parts

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